5th FORUM ON NEW MATERIALS PART B Proceedings of the 5th by Edited by Pietro VINCENZINI World Academy of Ceramics and

By Edited by Pietro VINCENZINI World Academy of Ceramics and National Research Council, Italy Co-edited by Hua-Tay LIN, Oak Ridge National Laboratory, USA Kevin FOX, Savannah River National Laboratory, USA

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The microstructural characterization was made by means of optical and scanning electron microscopy. The grain size was measured according to ISO 643:2003 standard using electrolytic oxalic acid as etching agent. The hardness was determined using the Vickers procedure with a 30 Kg load (HV30). 5 % and a subsequent loading rate of 6 mm/min until the end of the test. Results and discussion The chemical composition of Asturfer® 1 and Asturfer® 2 (AF1 and AF2) are shown in Table 1,compared with the Eurofer97-2 specification [7].

2 Experiment apparatus The CLAM specimens without coating were tested in the stirred pot device [11] located in NIFS (National Institute of Fusion Study) at 500oC and 600oC, respectively. 17m/s in the test. The pot was assembled in the glove box and the crucible was made of 9Cr steel. 1). 16m/s. The specimens fixed in the holder with iron wires rotated in the crucible, which was different from the impeller in the stirred pot at NIFS, so the flow velocity was calculated according to the rotation velocity of the electric motor and the distance of the specimens from the axes.

On the contrary, it is not the case at the lower irradiation temperature. Introduction Silicon carbide fiber-reinforced composite is one of the potential structural materials for next-generation fusion reactor because the newly-developed composite has low induced radioactivity, high specific strength, and high temperature strength. Silicon carbide fiber-reinforced silicon carbide matrix composites have good heat resistance and low activation under high energy neutron irradiation. The radiation stability of the microstructure in the advanced SiC/SiC composites is the current challenge, which limits the high-temperature applications.

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